総合カタログVer6.0

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安全のため、保護メガネ等の保護具を必ず着用してください。 工具の最高回転数を超えて使用しないでください。For your own safety, please wear eye protection. Please use SENTAN TOOL® within its maximum rotation speed.2095 ｜ BondC3 Factors of Grinding Stones5 Factors of Selecting Grinding StonesBondMarkComponentPoreCharacteristicVitrifiedＶPorcelainPore/Non-PoreHigh abrasive grain holding force with waterproof, oil proof and chemical proof. Comparatively long life with high grindability.Rarely aging in environment of normal temperature and humidity. Most popular bonding agent.ResinoidＢSynthetic Resin Pore/Non-PoreExcellent in high speed rotation use due to greater tensile strength and elasticity than vitrified.Incapable of use in high temperature environment. Generally not waterproof.RubberＲSyntheticNature RubberNon-PoreExcellent in grinding with high toughness against strong impact and high elasticity.Comparatively great finishing by cushion of rubber characteristic. Incapable of use in high temperature environment.Electro PlatedＰPlating Single-layer Double-layer MultilayerExcellent in grinding ability due to a large protruding grains.Enable to manufacture precision tool due to imitation of base metal shape.Metal BondedＭPowder MetallurgyNon-PoreExcellent in heat and abrasion resistances with strong abrasive grain holding force. Suitable for polishing and cutting glass lenses, ferrite and ceramic due to less shape change by abrasion. Separated to wet and dry processes.Bonding agent combining grains3 ｜ Grain SizeRelation between grain and grinding condition.Unit expressing grain size distribution in stages. The larger the numeric value, the smaller size of grain size. The grain size is important factor effecting roughness on surface.Powerful Grinding Performance WeakRough FinishingSuitable ApplicationFinishing WideTouch Area NarrowSoft Materials/Viscosity MaterialsCompatible Work MaterialHard Materials/Brittle MaterialsViscosityCompatible GradeBrittleRough-Grain#60#240#600#1200#5000Fine-Grain4 ｜ GradeRelation between grade and grinding condition　　　　　 Standard Degree of Bond…L～PIndex of abrasive grain holding force of grade. Degree of grade is described as alphabet.※More amount of bonding agent in identical capacity provides stronger and harder　bonding between grains.Hard Materials/Brittle MaterialsCompatible Work MaterialSoft Materials/Viscosity MaterialsFast Peripheral Velocity SlowWideTouch Area Narrow WeakGrinding Stone Strength StrongSoftA ・・・・ G　H　I　J　K　L　M　N　O　P　Q　R　S　T ・・・・ ZHard Segment GrainTypeCharacteristic1 ｜ Type of GrainTypes of Alumina, Silicon Carbide and Superabrasive are available.Select depending on each application due to each grain having each characteristic.Alumina-based Aluminium Oxide【Al2O3】 ・Knoop hardness ： Hk 1950～2200 ・Melting point：2050℃ABrown Aluminous Abrasives【Al2O3】More than 87.5%・Brown Corundum Crystal containing adequate amount of titanium oxide.・High toughness and less crystal hardness.Ａ/ＷＡMixed Brown/White Aluminous Abrasives【Al2O3】More than 92%・Mixed grain of A and WA grains. Characteristic close to A grain.ＷＡWhite Aluminous Abrasives【Al2O3】More than 98% ・White Corundum Crystal enhanced aluminous purity more than 98%.・Excellent in friability to grind high-hardness materials although toughness is less than A grain.ＰＡPink Aluminous Abrasives【Al2O3】More than 98%・Pink Corundum Crystal with chrome oxide added.・Toughness close to A grain and friability close to WA grain.ＳＡMono-Crystalline Fused Alumina【Al2O3】More than 98.5%・Mainly consisted of Mono-Crystalline Corundum which is not mechanically crushed.ＳＰPink Aluminous Abrasives【Al2O3】More than 98%・Having characteristic of microfracturing with higher purity than PA grain and high toughness.ＳＰHAlumina-base ceramic・Having characteristic of microfracturing with high toughness comparing with alumina abrasive grain.ＺZirconia Aluminous Abrasives【Al2O3】More than 65%【ZrO2】More than 25%・Having characteristic of microfracturing with better toughness than A grain.・Crystal hardness is slightly lower than A grain.Silicon-based Silicon Carbide【SiC】 ・Knoop hardness ： Hk 2900～3500 ・Crystal stability temperature：1600℃ＣBlack Silicon Carbide【SiC】More than 91%・Whole grained and comminuted of high purity ingot containing more than 91% Silicon Carbide.・High hardness and lower fracture toughness comparing with Alumina grain.・Excellent in autogenous actions with great sustaining power of sharpness.ＧＣGreen Silicon Carbide【SiC】More than 95%・Whole grained and comminuted of high purity ingot containing more than 95% Silicon Carbide.・High hardness and less toughness comparing with C grain.・Excellent in autogenous actions with great sustaining power of sharpness.Diamond ・Knoop hardness ：Hk 6000～12000 ・Melting point ：3550℃ D:NaturalSD:ArtificialCarbon【C】100%・Carbon bond body having perfect crystal structure.・Excellent in widely grinding and cutting because of great abrasion and deposition resistances and scientific stability with tiny thermal expansion coefficient.Cubic Boron Nitride ・Knoop hardness ：Hk 4700 ・Crystal stability temperature ：1370℃CＢＮHexagonal Boron Nitride 【h-BN】・The second hardest artificial material. 　・Excellent in heat resistance and can be used even under severe conditions.・Clogging is rarely happened and no chemical reaction against any metals.・Excellent in grinding performance having adequate friability by polycrystalline structure.2 ｜ Structure (Grain Ratio)Index of grain ratio in bulk density of grinding stones.Relation between Grain Ratio and Grinding ConditionHard Materials /Brittle MaterialsSoft Materials/Viscosity MaterialsNarrowWideFine 062%Grain RatioFinish Roughness Standard Grain Ratio…49～51%Touch AreaApplicableWork Material 34%◀ 48% ▶▶▶▶1234567891011121314RoughDescription of Mounted points◆High-hardness granulated or powdered substance grinding mainly on　workpiece as cutting point.◆Having characteristic to maintain its grinding force by reconditioning new　cutting point by repeating own minor crushing of crystal（Autogenous actions）.◆Adhesive material to keep binding grains.◆Controllable grinding performance by adjusting grade for 8 types of bonds.◆Air spaces between grains and bondings.◆Serving as heat radiator and eliminator of chips（non-pores type is also available）.Grain BondPoreGrindingstone

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